LG

■ Introducing next-generation material portfolio for advanced packaging and power semiconductors
 
■ Expanding collaboration with major semiconductor companies and exploring new project opportunities
 
 
SEOUL, August 26, 2026 ― LG Chem will participate in SEMICON Taiwan 2026, Asia’s largest semiconductor exhibition, to showcase advanced packaging and power semiconductor material solutions for AI semiconductors and expand collaboration with semiconductor customers.
 
At SEMICON Taiwan 2026, taking place from September 2 to 4 at the Taipei Nangang Exhibition Center in Taipei, Taiwan, LG Chem will showcase a range of advanced semiconductor materials targeting applications including high-bandwidth memory (HBM) and AI semiconductors.
 
The event brings together major industry players, including semiconductor manufacturers, outsourced semiconductor assembly and test (OSAT) companies, and substrate and packaging companies, serving as a key platform for technology exchange and business collaboration.
 
LG Chem will be located at Booth No. S7430 on the fourth floor of Hall 2 (TaiNEX 2), introducing a range of semiconductor material solutions targeting the growing AI semiconductor and high-performance computing (HPC) markets.
 
LG Chem’s Advanced Package Zone will feature a broad portfolio of materials for advanced packaging processes, including copper clad laminates (CCL), glass core solutions, build-up films, dry film solder resist (DFSR), photo imageable dielectrics (PID), die attach films (DAF), bonding and debonding solutions, and strippers for fine-pitch processes.
 
Meanwhile, the Power Package Zone will showcase key materials designed to improve the efficiency and thermal management of power semiconductors used in AI data centers. 
 
These include conductive sintering pastes (Ag/Cu), thermal interface materials (TIM), and thermal management device solutions based on copper metal foam, which improve semiconductor performance through enhanced power efficiency and heat dissipation.
 
Through this exhibition, LG Chem plans to expand collaboration with major semiconductor manufacturers, OSAT companies, and substrate and packaging companies. The company aims to broaden its customer base in the AI semiconductor and advanced packaging markets and accelerate the growth of its semiconductor materials business through technology exchanges and by identifying new project opportunities.
 
“As the AI semiconductor and advanced packaging markets continue to expand, customer demand for high-performance materials is increasing,” said Kim Dong Choon, CEO of LG Chem. “Building on our differentiated materials portfolio, LG Chem will strengthen collaboration with semiconductor customers and actively pursue growth opportunities in the semiconductor market of the future.”