LG

■ LG Chem has begun mass production and supply of its first semiconductor stripper to global OSAT leader Amkor Technology
 
■ LG Chem’s customized process materials reduced photoresist and residue removal time by approximately 50%, enhancing manufacturing efficiency for advanced semiconductor packaging
 
■ This milestone will strengthen LG Chem’s semiconductor packaging materials portfolio as the company accelerates growth in high-value electronic materials amid rising AI and HBM-driven demand for advanced packaging
 
 
SEOUL, July 16, 2026 ― LG Chem announced today that it has begun mass production and supply of semiconductor strippers to Amkor Technology, marking the company’s first entry into the semiconductor stripper market and accelerating its strategy to expand its semiconductor materials business.
 
Amkor Technology is a global leader in outsourced semiconductor assembly and test (OSAT), providing semiconductor packaging and testing services to leading semiconductor manufacturers worldwide.
 
A semiconductor stripper is a critical process material used to remove photoresist (PR) and residue remaining on semiconductor substrates after circuit patterning. As semiconductor circuits continue to shrink, residue removal performance has become increasingly important, directly affecting manufacturing yield and product reliability. As a result, stripper performance is considered a key factor in determining semiconductor quality.
 
LG Chem entered the semiconductor stripper market by leveraging the technological expertise and customer support capabilities it developed through its display stripper business.
 
The company demonstrated its technology’s competitiveness by successfully passing the rigorous qualification process required by Amkor, a leading global OSAT customer, with its first semiconductor stripper product.
 
The stripper supplied to Amkor has been customized and optimized for the company’s new production line. Compared with existing products, it reduces the process time required to remove photoresist and process residue by approximately 50%, significantly improving manufacturing efficiency.
 
Demand for advanced process materials continues to grow as artificial intelligence (AI) investments and high-bandwidth memory (HBM) demand drive the expansion of advanced semiconductor packaging technologies.
 
“Through our collaboration with Amkor, a world-class semiconductor packaging and testing company, we will further strengthen our competitiveness in delivering customized materials optimized for customers’ manufacturing processes,” said Kim Dong Choon, CEO of LG Chem.
 
Earlier this year, LG Chem announced a strategy to more than double the size of its electronics materials business. As part of this initiative, the company is expanding its semiconductor packaging materials portfolio ― including copper-clad laminates (CCL), die attach films (DAF), and photo imageable dielectric (PID) ― while accelerating the growth of its high-value-added electronic materials business.